LSD4 激光扫描缺陷成像系统

产品描述:
激光扫描缺陷成像仪是激光束感应电流(LBIC)测试的升级版本。 它利用波长能量大于半导体能隙的激光光束照射半导体,产生电子-电洞对。 透过快速扫描样品表面,获得揭示内部电流变化的影像分布,以分析各种缺陷分布。 这有助于分析样品制备的质量,并有助于制程改进。


产品特点

4 分钟内掌握全貌,以 50 微米分辨率扫描 100 毫米 x 100 毫米区域

激光扫描缺陷成像仪是激光束感应电流(LBIC)测试的升级版本。 它利用波长能量大于半导体能隙的激光光束照射半导体,产生电子-电洞对。 透过快速扫描样品表面,获得揭示内部电流变化的影像分布,以分析各种缺陷分布。 这有助于分析样品制备的质量,并有助于制程改进。

 

1.扫描光生电流的分布

2.分析表面污染

3.扫描光电压的分布

4.分析短路区域的分布

5.扫描开路电压和短路电流的分布

6.识别和分析微裂纹区域

7.分析少数载子扩散长度的分布(选配功能)



产品参数


Item

Parameter Description.



Function

a. Utilizing laser beams with wavelengths   that have higher energy than the semiconductor bandgap to generate   electron-hole pairs in the semiconductor, exploring the impact of the   depletion region on internal current changes to understand and analyze various   defect distributions as a direction for process improvement.
 
b. Capable of scanning the distribution of photo-generated current on the   surface of the sample.
 
c. Capable of scanning the distribution of photo-voltage on the surface of  the sample.
 
d. Capable of scanning the distribution of open-circuit voltage and   short-circuit current.
 
e. Capable of analyzing surface contamination.
 
f. Capable of analyzing the distribution of short-circuit regions.
 
g. Capable of identifying and analyzing microcrack regions.
 
h. Capable of analyzing the distribution of minority carrier diffusion length   (optional).

Excitation   source

405   ±10nm Laser
520 ±10nm Laser
635 ±10nm Laser
830 ±10nm Laser

Scan area

≧100mm x 100mm

Laser   spot size

Close   to TEM00 mode spot

Mapping resolution

a. Scanning resolution ≤ 50 µm
b. Scanning resolution can be set by software

Mapping   time

<4   mins (For 100 mm´100 mm with 50 um resolution)

Dimension

60 cm * 60 cm * 100 cm

Software

a.   LBIC 3D visualization
b. 2D cross-sectional analysis (electrode aspect ratio)
c. Photo-current response distribution analysis (in conjunction with   long-wavelength laser source)
d. Data saving and export functions




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